ADDENDUM No. 1 to JESD35 – GENERAL GUIDELINES FOR DESIGNING TEST STRUCTURES FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS
standard by JEDEC Solid State Technology Association, 09/01/1995
JEDEC JESD22-B110B.01
Mechanical Shock – Device and Subassembly
standard by JEDEC Solid State Technology Association, 06/01/2019
JEDEC JESD22-A102E
ACCELERATED MOISTURE RESISTANCE – UNBIASED AUTOCLAVE
standard by JEDEC Solid State Technology Association, 07/01/2015
JEDEC JESD22-B117B
SOLDER BALL SHEAR
standard by JEDEC Solid State Technology Association, 05/01/2014
JEDEC JESD 84-C44
EMBEDDED MULTIMEDIACARD (e-MMC) MECHANICAL STANDARD, WITH OPTIONAL RESET SIGNAL
standard by JEDEC Solid State Technology Association, 07/01/2009
JEDEC JESD22-A108F
TEMPERATURE, BIAS, AND OPERATING LIFE
standard by JEDEC Solid State Technology Association, 07/01/2017
JEDEC JEP001-3A
FOUNDRY PROCESS QUALIFICATION GUIDELINES – PRODUCT LEVEL (Wafer Fabrication Manufacturing Sites)
standard by JEDEC Solid State Technology Association, 09/01/2018
JEDEC JESD 82-25
DEFINITION OF the SSTUB32866 1.8 V CONFIGURABLE REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007
JEDEC JESD211
ZENER AND VOLTAGE REGULATOR DIODE RATING VERIFICATION AND CHARACTERIZATION TESTING
standard by JEDEC Solid State Technology Association, 12/01/2009
JEDEC JESD205
FBDIMM STANDARD: DDR2 SDRAM FULLY BUFFERED DIMM (FBDIMM) DESIGN SPECIFICATION
standard by JEDEC Solid State Technology Association, 03/01/2007