EMBEDDED MULTIMEDIACARD (e-MMC) MECHANICAL STANDARD, WITH OPTIONAL RESET SIGNAL
standard by JEDEC Solid State Technology Association, 07/01/2009
JEDEC JESD22-A108F
TEMPERATURE, BIAS, AND OPERATING LIFE
standard by JEDEC Solid State Technology Association, 07/01/2017
JEDEC JEP001-3A
FOUNDRY PROCESS QUALIFICATION GUIDELINES – PRODUCT LEVEL (Wafer Fabrication Manufacturing Sites)
standard by JEDEC Solid State Technology Association, 09/01/2018
JEDEC JESD219A_MT
Master Trace for 128 GB SSD
Directive by JEDEC Solid State Technology Association, 07/01/2012
JEDEC JESD 35-1
ADDENDUM No. 1 to JESD35 – GENERAL GUIDELINES FOR DESIGNING TEST STRUCTURES FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS
standard by JEDEC Solid State Technology Association, 09/01/1995
JEDEC JESD22-B110B.01
Mechanical Shock – Device and Subassembly
standard by JEDEC Solid State Technology Association, 06/01/2019
JEDEC JESD22-A102E
ACCELERATED MOISTURE RESISTANCE – UNBIASED AUTOCLAVE
standard by JEDEC Solid State Technology Association, 07/01/2015
JEDEC JESD22-B115A
SOLDER BALL PULL
standard by JEDEC Solid State Technology Association, 08/01/2010
JEDEC JESD22-A100C
CYCLED TEMPERATURE HUMIDITY BIAS LIFE TEST
standard by JEDEC Solid State Technology Association, 10/01/2007
JEDEC JESD241
Procedure for Wafer-Level DC Characterization of Bias Temperature Instabilities
standard by JEDEC Solid State Technology Association, 12/01/2015