Half Price Standard Code

POD125 – 1.25 V PSEUDO OPEN DRAIN I/O
standard by JEDEC Solid State Technology Association, 09/01/2017

ADDENDUM No. 10 to JESD24 – TEST METHOD FOR MEASUREMENT OF REVERSE RECOVERY TIME trr FOR POWER MOSFET DRAIN-SOURCE DIODES
Amendment by JEDEC Solid State Technology Association, 08/01/1994

STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 02/01/2011

GUIDELINE FOR CONSTANT TEMPERATURE AGING TO CHARACTERIZE ALUMINUM INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
standard by JEDEC Solid State Technology Association, 12/01/2000

Universal Flash Storage (UFS) Test
standard by JEDEC Solid State Technology Association, 07/01/2017

Embedded Multi-media card (e*MMC), Electrical Standard 4.51
standard by JEDEC Solid State Technology Association, 06/01/2012

Implementation of the Electrical Test Method for the Measurement of Real Thermal Resistance and Impedance of Light-emitting Diodes with Exposed Cooling Surface
standard by JEDEC Solid State Technology Association, 04/18/2012

STATISTICAL PROCESS CONTROL SYSTEMS
standard by JEDEC Solid State Technology Association, 02/01/2006

ADDENDUM No. 5 to JESD12 – DESIGN FOR TESTABILITY GUIDELINES
Amendment by JEDEC Solid State Technology Association, 08/01/1988

WIRE BOND SHEAR TEST
standard by JEDEC Solid State Technology Association, 04/01/2017