Performance Standard for Ball Grid Array Balls (IPC/EIA J-STD-032)
standard by Association Connecting Electronics Industries, 06/01/2002
IPC 7093
Design and Assembly Process Implementation for Bottom Termination Components
standard by Association Connecting Electronics Industries, 03/28/2011
IPC A-610F-WAM1
Acceptability of Electronic Assemblies – Incorporates Amendment 1
standard by Association Connecting Electronics Industries, 02/01/2016
IPC DRM-18H
Component Identification Training and Reference Guide
standard by Association Connecting Electronics Industries, 12/01/2007
IPC A-610F
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014
IPC D-310C
Guidelines for Phototool Generation and Measurement Techniques
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/1991
IPC J-STD-006C
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
standard by Association Connecting Electronics Industries, 07/01/2013
IPC CC-830B
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
standard by Association Connecting Electronics Industries, 08/01/2002
IPC TR-461
Solderability Evaluation of Thick and Thin Fused Coatings
standard by Association Connecting Electronics Industries, 03/01/1979
IPC FLEX-CO-99
IPC National Conference Flexible Circuits Volume I & II – Denver, CO 1999
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999