Half Price Standard Code

Results of IPC Copper Foil Ductility Round Robin Study
standard by Association Connecting Electronics Industries, 04/01/1986

Specification and Characterization Methods for Nonwoven "E" Glass Materials
standard by Association Connecting Electronics Industries, 09/01/1998

Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
standard by Association Connecting Electronics Industries, 09/01/2013

Surface Insulation Resistance Handbook
standard by Association Connecting Electronics Industries, 04/01/1990

An In-Depth Look At Ionic Cleanliness Testing
standard by Association Connecting Electronics Industries, 07/01/2002

Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 03/01/2000

Time, Temperature and Humidity Stress of Final Board Finish Solderability
standard by Association Connecting Electronics Industries, 05/01/2006

Specification for Finished Fabric Woven from "E" Glass for Printed Boards
standard by Association Connecting Electronics Industries, 01/01/2006

Requirements and Acceptance for Cable and Wire Harness Assemblies
standard by Association Connecting Electronics Industries, 07/01/2006

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
standard by Association Connecting Electronics Industries, 07/01/2001