Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2009
IPC J-STD-026
Semiconductor Design Standard for Flip Chip Applications
standard by Association Connecting Electronics Industries, 04/01/1999
IPC 4412B – Amendment 2
Specification for Finished Fabric Woven from "E" Glass for Printed Boards – Amendment 2
Amendment by Association Connecting Electronics Industries, 05/01/2018
IPC J-STD-046
Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers
standard by Association Connecting Electronics Industries, 07/01/2016
IPC QL-653A
Qualification of Facilities That Inspect / Test Printed Boards, Components and Materials
standard by Association Connecting Electronics Industries, 11/01/1997
IPC 7095A
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 01/01/2005
IPC 1752A
Materials Declaration Management
standard by Association Connecting Electronics Industries, 03/01/2010
IPC PE-740A
Troubleshooting Guide for Printed Board Manufacture and Assembly
standard by Association Connecting Electronics Industries, 12/01/1997
IPC 4921A
Requirements for Printed Electronics Base Materials (Substrates)
standard by Association Connecting Electronics Industries, 05/01/2017
IPC JP002
JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
standard by Association Connecting Electronics Industries, 03/01/2006