Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2009
IPC J-STD-026
Semiconductor Design Standard for Flip Chip Applications
standard by Association Connecting Electronics Industries, 04/01/1999
IPC 4412B – Amendment 2
Specification for Finished Fabric Woven from "E" Glass for Printed Boards – Amendment 2
Amendment by Association Connecting Electronics Industries, 05/01/2018
IPC J-STD-046
Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers
standard by Association Connecting Electronics Industries, 07/01/2016
IPC J-STD-020B
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
standard by Association Connecting Electronics Industries, 07/01/2002
IPC HDBK-850
Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
standard by Association Connecting Electronics Industries, 07/01/2012
IPC ENVIRONMENT
Environmental Best Practices Guide
standard by Association Connecting Electronics Industries,
IPC QL-653A
Qualification of Facilities That Inspect / Test Printed Boards, Components and Materials
standard by Association Connecting Electronics Industries, 11/01/1997
IPC 7095A
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 01/01/2005
IPC 1752A
Materials Declaration Management
standard by Association Connecting Electronics Industries, 03/01/2010