Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2
standard by Association Connecting Electronics Industries, 12/01/2012
IPC TA-722
Technology Assessment Handbook on Soldering
standard by Association Connecting Electronics Industries,
IPC 2541
Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX)
standard by Association Connecting Electronics Industries, 10/01/2001
IPC DLS-2001
Technical Proceedings for the Designers Learning Symposium – 2001
Conference Proceeding by Association Connecting Electronics Industries, 07/18/2001
IPC J-STD-002E
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 11/01/2017
IPC 6012C
Qualification and Performance Specification for Rigid Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2010
IPC 4562
Metal Foil for Printed Wiring Applications, Includes Amendment 1
standard by Association Connecting Electronics Industries, 05/01/2000
IPC 4103A
Specification for Base Materials for High Speed/High Frequency Applications
standard by Association Connecting Electronics Industries, 12/01/2011
IPC A-40
Solder Mask Artwork
standard by Association Connecting Electronics Industries,
IPC LDFR0603
IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium – June 2003)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003