TMRC Technology Trends for Rigid Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 06/27/2000
IPC 2591
Connected Factory Exchange (CFX)
standard by Association Connecting Electronics Industries, 03/01/2019
IPC D-354
Library Format Description for Printed Boards in Digital Form
standard by Association Connecting Electronics Industries, 02/01/1987
IPC 1751A
Generic Requirements for Declaration Process Management
standard by Association Connecting Electronics Industries, 02/01/2010
IPC J-STD-004
Requirements for Soldering Fluxes
standard by Association Connecting Electronics Industries,
IPC TR-462
Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage
standard by Association Connecting Electronics Industries, 10/01/1987
IPC J-STD-609
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes
standard by Association Connecting Electronics Industries, 05/01/2007
IPC HM-860
Specification for Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 01/10/1987
IPC 7095C
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 01/01/2013
IPC T-50G
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
standard by Association Connecting Electronics Industries, 12/01/2003