Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
standard by Association Connecting Electronics Industries, 05/01/1999
IPC SM-840E
Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Materials
standard by Association Connecting Electronics Industries, 12/01/2010
IPC DW-425A
Design and End Product Requirements for Discrete Wiring Boards
standard by Association Connecting Electronics Industries, 05/01/1995
IPC A-39
Small Hole Reliability Round Robin Artwork
standard by Association Connecting Electronics Industries, 09/01/1988
IPC 6013B
Qualification and Performance Specification for Flexible Printed Boards
standard by Association Connecting Electronics Industries, 01/01/2009
IPC 4101A
Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)
standard by Association Connecting Electronics Industries, 06/01/2002
IPC 2291
Design Guideline for Printed Electronics
standard by Association Connecting Electronics Industries, 06/01/2013
IPC ML-960
Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 07/01/1994
IPC 6801
Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
standard by Association Connecting Electronics Industries, 01/01/2000
IPC WP-024
White Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market
standard by Association Connecting Electronics Industries, 08/01/2018