Cleaning and Cleanliness Test Program Phase 1 Test Results
standard by Association Connecting Electronics Industries, 10/01/1989
IPC J-STD-003C-WAM1&2
Solderability Tests for Printed Boards with Amendment 1&2
standard by Association Connecting Electronics Industries, 09/01/2017
IPC A-36-G
Cleaning Alternatives Artwork – Gerber Format
standard by Association Connecting Electronics Industries,
IPC 6012D-AM1
Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 09/01/2017
IPC 2225
Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
standard by Association Connecting Electronics Industries, 05/01/1998
IPC 2224
Standard for Design of Printed Wiring Boards for PCMCIAs
standard by Association Connecting Electronics Industries, 01/01/1998
IPC TMRC99F
TMRC 1999 Market for Flexible Circuits
Report / Survey by Association Connecting Electronics Industries, 06/27/2000
IPC 6016
Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
standard by Association Connecting Electronics Industries, 05/01/1999
IPC 9708
Test Methods for Characterization of Printed Board Assembly Pad Cratering
standard by Association Connecting Electronics Industries, 12/01/2010
IPC J-STD-001E
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 04/01/2010