Half Price Standard Code

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017

Generic Requirements for Surface Mount Land Pattern and Design Standard – INCLUDES LAND PATTERN VIEWER SOFTWARE
standard by Association Connecting Electronics Industries, 02/01/2007

IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies (Correcting the Misunderstandings on "Halogen-Free")
standard by Association Connecting Electronics Industries, 08/01/2007

The Effect of Steam Aging Time and Temperature on Solderability Test Results
standard by Association Connecting Electronics Industries, 01/01/1993

Process Capability, Quality and Relative Reliability (PQCR2) Benchmark Test Standard and Database
standard by Association Connecting Electronics Industries, 05/01/2012

Qualifications and Performance of Polymer Thick Film Printed Boards
standard by Association Connecting Electronics Industries, 01/01/1987

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
standard by Association Connecting Electronics Industries, 03/01/2008

Sectional Requirements for Board Fabrication Documentation
standard by Association Connecting Electronics Industries, 03/01/2010

Rigid Printed Board Manual
Handbook / Manual / Guide by Association Connecting Electronics Industries,

Specification for Finished Fabric Woven from Aramid for Printed Boards
standard by Association Connecting Electronics Industries, 06/01/1990