Design Guide for High-Speed Controlled Impedance Circuit Boards
standard by Association Connecting Electronics Industries, 03/01/2004
IPC TR-485
Results of Copper Foil Rupture Strength Test Round Robin Study
standard by Association Connecting Electronics Industries, 03/01/1985
IPC 9252A
Requirements for Electrical Testing of Unpopulated Printed Boards
standard by Association Connecting Electronics Industries, 11/01/2008
IPC J-STD-013
Implementation of Ball Grid Array and Other High Density Technology
standard by Association Connecting Electronics Industries, 08/01/1996
IPC 6018A
Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 01/01/2002
IPC 2512A
Sectional Requirements for Implementation of Administrative Methods for Mfg. Data Description
standard by Association Connecting Electronics Industries, 11/01/2000
IPC J-STD-033
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
standard by Association Connecting Electronics Industries, 04/01/1999
IPC 9850
Surface Mount Placement Equipment Characterization
standard by Association Connecting Electronics Industries, 07/01/2002
IPC 2581
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
standard by Association Connecting Electronics Industries, 05/01/2012
IPC 2501
Definition for Web-Based Exchange of XML Data
standard by Association Connecting Electronics Industries, 07/01/2003