Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2016
IPC 7095B
Design and Assembly Process Implementation for BGAs
standard by Association Connecting Electronics Industries, 03/01/2008
IPC 2615
Printed Board Dimensions and Tolerances
standard by Association Connecting Electronics Industries, 07/01/2000
IPC 4556
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 01/01/2013
IPC 4204A
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/31/2012
IPC 4202
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
standard by Association Connecting Electronics Industries, 05/01/2002
IPC 9201A
Surface Insulation Resistance Handbook
standard by Association Connecting Electronics Industries, 09/01/2007
IPC 4101D-WAM1
Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1
standard by Association Connecting Electronics Industries, 07/01/2015
IPC 6901
Application Categories for Printed Electronics
standard by Association Connecting Electronics Industries, 07/01/2015
IPC 6018B
Microwave End Product Board Inspection and Test
standard by Association Connecting Electronics Industries, 11/01/2011